3M™ 5419 Low-Static Polyimide Film Tape 3/4"W x 36 Yards 2.7 Mil Gold - 7000036206
3M™ LOW STATIC POLYIMIDE FILM TAPE 5419 WITH DUPONT™ KAPTON® POLYIMIDE FILM AND SILICONE ADHESIVE USED FOR PCB SOLDER MASKING AND OTHER HIGH TEMPERATURE APPLICATIONS. LOW STATIC. EMPLOYS A PROPRIETARY TECHNOLOGY THAT RESULTS IN EXTREMELY LOW ELECTROSTATIC DISCHARGE AT UNWIND AND REMOVAL FROM THE PWB. CONVENTIONAL POLYIMIDE TAPES CAN TYPICALLY GENERATE OVER 10000 VOLTS DURING USE WHICH CAN DAMAGE BOARD MOUNTED ELECTRONIC COMPONENTS. 3M™ TAPE 5419 OVERCOMES THIS PROBLEM WITHOUT ANY OF THE TYPICAL DRAWBACKS OF CONVENTIONAL "ANTI-STATIC" OR "STATIC-FREE" TAPES (E.G. VARIABLE ADHESION AND OPAQUENESS). HALOGEN FREE DEFINITION "HALOGEN FREE" REFERS TO THE INTERNATIONAL ELECTROCHEMICAL COMMISSION'S DEFINITION IEC 61249-2-21 WHICH SETS THE LIMITS OF 900 PPM MAXIMUM CHLORINE; 900 PPM MAXIMUM BROMINE; 1500 PPM MAXIMUM TOTAL HALOGENS. DUPONT™ KAPTON® POLYIMIDE FILM DOES NOT SOFTEN AT ELEVATED TEMPERATURES THUS THE FILM PROVIDES AN EXCELLENT RELEASE SURFACE AT ELEVATED TEMPERATURES. FEATURES UL STYLE"MARGIN-TOP0PX; PADDING-TOP 5PX; PADDING-BOTTOM 5PX;" OFFERS DEPENDABLE PERFORMANCE IN DEMANDING ENVIRONMENTS ENSURING MINIMAL DISRUPTION NO REWORK REQUIRED ENABLING HIGH PRODUCTIVITY HALOGEN FREE OFFERING ENVIRONMENTAL COMPLIANCE AND REDUCED HEALTH RISKS IN DIVERSE INDUSTRIES PROTECTS SURFACES HELPING REDUCE REPLACEMENT PARTS RECOMMENDED APPLICATIONS UL STYLE"MARGIN-TOP0PX; PADDING-TOP 5PX; PADDING-BOTTOM 5PX;" MASK FOR PRINTED CIRCUIT BOARDS DURING WAVE SOLDER OR SOLDER DIP PROCESS USED AS RELEASE SURFACE IN FABRICATION OF PARTS CURED AT ELEVATED TEMPERATURES
Priced: EA
Minimum Order Qty: 12
Typical Lead Time: 8 Days
Not Returnable or Cancelable!
